epoxy coated reinforcement - перевод на русский
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epoxy coated reinforcement - перевод на русский

EPOXY-BASED POWDER COATING USED TO PROTECT STEEL PIPE ETC. FROM CORROSION
FBE Coatings; Fusion bonded epoxy; Fusion-bonded epoxy; Fusion bonded epoxy powder coating; Fusion Bonded Epoxy Coatings; Fusion Bonded Epoxy; Fusion Bonded Epoxy Powder Coatings; FBE coating; Fusion-bond epoxy powder coating; Epoxy-coated
Найдено результатов: 204
epoxy coated reinforcement      

строительное дело

арматура с защитным эпоксидным покрытием

epoxy coated reinforcement      
арматура с защитным эпоксидным покрытием
epoxy resin         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied

строительное дело

эпоксидная смола

epoxy adhesive         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied
эпоксидный клеящий состав
epoxide resin         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied

медицина

эпоксидная смола

epoxy resin         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied
эпоксидная смола
epoxy adhesive         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied

строительное дело

эпоксидный клеящий состав

epoxy         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied
эпоксидная смола, эпоксидный клей || склеивать эпоксидной смолой
epoxy         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied

[i'pɔksi]

общая лексика

эпоксидный

строительное дело

эпоксидная смола, эпоксидный клей

склеивать эпоксидной смолой

существительное

[i'pɔksi]

техника

эпоксидная смола

эпоксидный клей

глагол

техника

склеивать эпоксидной смолой

epoxy resin         
  • The interior of a pocket calculator. The dark lump of epoxy in the center covers the processor chip
  • Structure of bisphenol-A diglycidyl ether epoxy resin: ''n'' denotes the number of polymerized subunits and is typically in the range from 0 to 25
  • A syringe of "5-minute" epoxy glue, containing separate compartments for the epoxy resin and the hardener
  • encapsulated]] [[hybrid circuit]] on a [[printed circuit board]].
  • TETA]], a typical hardener. The amine (NH2) groups react with the epoxide groups of the resin during polymerisation.
  • curing]] underwater. The blue-coloured epoxy on the left is still undergoing curing
  • Structure of a cured epoxy glue. The triamine hardener is shown in red, the resin in black. The resin's epoxide groups have reacted with the hardener and are not present anymore. The material is highly [[crosslink]]ed and contains many OH groups, which confer adhesive properties
FAMILY OF TWO-PART ADHESIVE RESINS
Epoxy resin; Epoxy resins; Epoxide Resins; Epoxide resin; Epoxide resins; Polyepoxide; Epoxy compounds; Epoxy glue; Epoxy molding compound; Epoxy adhesive; Epoxy coating; Epoxy cement; Epoxied
эпоксидная смола

Определение

Reinforce
·noun ·see Reenforce, ·noun.
II. Reinforce ·vt ·see Reenforce, ·vt.

Википедия

Fusion bonded epoxy coating

Fusion bonded epoxy coating, also known as fusion-bond epoxy powder coating and commonly referred to as FBE coating, is an epoxy-based powder coating that is widely used to protect steel pipe used in pipeline construction from corrosion. It is also commonly used to protect reinforcing bars (though being phased out as of 2005) and on a wide variety of piping connections, valves etc. FBE coatings are thermoset polymer coatings. They come under the category of protective coatings in paints and coating nomenclature. The name fusion-bond epoxy is due to resigning cross-link and the application method, which is different from a conventional paint. In 2020 the market size was quoted at 12 billion dollars.

The resin and hardener components in the dry powder FBE stock remain unreacted at normal storage conditions. At typical coating application temperatures, usually in the range of 180 to 250 °C (356 to 482 °F), the contents of the powder melt and transform to a liquid form. The liquid FBE film wets and flows onto the steel surface on which it is applied, and soon becomes a solid coating by chemical cross-linking, assisted by heat. This process is known as “fusion bonding”. The chemical cross-linking reaction taking place in this case is irreversible. Once the curing takes place, the coating cannot be returned to its original form by any means. Application of further heating will not “melt” the coating and thus it is known as a “thermoset” coating.

Как переводится epoxy coated reinforcement на Русский язык